Resinpal 2791 is a clear epoxy adhesive.
The thixotropic Resinpal 2791 epoxy adhesive is suitable for bonding metal, wood, rigid foams, GRP components, concrete, stone etc.
The clear nature of the epoxy adhesive ensures that the user can check or adjust the area to be bonded through the resin.
The Resinpal 2791 epoxy adhesive can be filled with fillers such as cotton flakes, glass fiber chips, glass bubbles. As a result, the viscosity or the mechanical properties of the epoxy adhesive can be changed.
Resinpal 2791 is mixed with the supplied hardener in a ratio of 100: 50 (by weight). The mixture should be stirred until homogeneous. Resinpal 2791 can be mixed with epoxy color pastes. The optimum processing temperature is 18 degrees. The processing time is about 20 to 25 minutes.